| Judul | Components Tap Future White Goods / TETSUO HIRAYAMA |
| Pengarang | HIRAYAMA, Tetsuo |
| EDISI | Edisi Vol. 19, Serial No. 210 March 2014 |
| Penerbitan | Dempa Asia Electronics Industry, 2014 |
| Deskripsi Fisik | 49 halaman :Tabel, Gambar ;21x28 cm |
| Catatan | Special Report : Mountable Devices Shrink, 3D Poises as Mainstream Chip Design |
| Tag | Ind1 | Ind2 | Isi |
| 001 | INLIS000000000006376 | ||
| 005 | 20220610011818 | ||
| 035 | # | # | $a 0010-0622000237 |
| 082 | # | # | $a 050.37 |
| 084 | # | # | $a 050.37 HIR c |
| 100 | 1 | # | $a HIRAYAMA, Tetsuo |
| 245 | 1 | # | $a Components Tap Future White Goods /$c TETSUO HIRAYAMA |
| 250 | # | # | $a Edisi Vol. 19, Serial No. 210 March 2014 |
| 260 | # | # | :$b Dempa Asia Electronics Industry,$c 2014 |
| 300 | # | # | $a 49 halaman : $b Tabel, Gambar ; $c 21x28 cm |
| 500 | # | # | $a Special Report : Mountable Devices Shrink, 3D Poises as Mainstream Chip Design |
| 990 | # | # | $a 22/MJ-16 |
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