| Judul | 3D V-Nand Solves Chip Design Limits Anodes Comply with Global Standard / TETSUO HIRAYAMA |
| Pengarang | HIRAYAMA, Tetsuo |
| EDISI | Edisi Vol. 18, Serial No. 207 Desember 2013 |
| Penerbitan | Dempa Asia Electronics Industry, 2013 |
| Deskripsi Fisik | 54 halaman :Tabel, Gambar ;21x28 cm |
| Catatan | Technology Focus : Board Bending Gets Boost Timing Device Shapes up, Special Report : Components Hinge on New Phone Features |
| Bentuk Karya | Tidak ada kode yang sesuai |
| Target Pembaca | Tidak ada kode yang sesuai |
| Tag | Ind1 | Ind2 | Isi |
| 001 | INLIS000000000006350 | ||
| 005 | 20220610104913 | ||
| 005 | 20220610105133 | ||
| 008 | 220610################|##########|#|## | ||
| 035 | # | # | $a 0010-0622000211 |
| 082 | # | # | $a 050.37 |
| 084 | # | # | $a 050.37 HIR t |
| 100 | 1 | # | $a HIRAYAMA, Tetsuo |
| 245 | 1 | # | $a 3D V-Nand Solves Chip Design Limits Anodes Comply with Global Standard /$c TETSUO HIRAYAMA |
| 250 | # | # | $a Edisi Vol. 18, Serial No. 207 Desember 2013 |
| 260 | # | # | :$b Dempa Asia Electronics Industry,$c 2013 |
| 300 | # | # | $a 54 halaman : $b Tabel, Gambar ; $c 21x28 cm |
| 500 | # | # | $a Technology Focus : Board Bending Gets Boost Timing Device Shapes up, Special Report : Components Hinge on New Phone Features |
| 990 | # | # | $a 04/MJ-16 |
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