| Judul | Latest IC Processes Take Limelight / TETSUO HIRAYAMA |
| Pengarang | HIRAYAMA, Tetsuo |
| EDISI | Edisi Vol. 19, Serial No. 216 September 2014 |
| Penerbitan | Dempa Asia Electronics Industry, 2014 |
| Deskripsi Fisik | 83 halaman :Tabel, Gambar ;21x28 cm |
| Catatan | Nepcon South China 2014 : SMT Firms Set Sights on 3D-MID Placement In View This Month : Taiwan Beefs up IC Capex |
| Bentuk Karya | Tidak ada kode yang sesuai |
| Target Pembaca | Tidak ada kode yang sesuai |
| Lokasi Akses Online | OPAC (Rak 1.4) |
| Tag | Ind1 | Ind2 | Isi |
| 001 | INLIS000000000006354 | ||
| 001 | INLIS000000000006358 | ||
| 005 | 20220610110650 | ||
| 005 | 20250324110238 | ||
| 008 | 250324################|##########|#|## | ||
| 035 | # | # | $a 0010-0622000215 |
| 035 | # | # | $a 0010-0622000219 |
| 082 | # | # | $a 050.37 |
| 084 | # | # | $a 050.37 HIR l |
| 100 | 1 | # | $a HIRAYAMA, Tetsuo |
| 245 | 1 | # | $a Latest IC Processes Take Limelight /$c TETSUO HIRAYAMA |
| 250 | # | # | $a Edisi Vol. 19, Serial No. 216 September 2014 |
| 260 | # | # | :$b Dempa Asia Electronics Industry,$c 2014 |
| 300 | # | # | $a 83 halaman : $b Tabel, Gambar ; $c 21x28 cm |
| 500 | # | # | $a Nepcon South China 2014 : SMT Firms Set Sights on 3D-MID Placement In View This Month : Taiwan Beefs up IC Capex |
| 856 | # | # | $a OPAC (Rak 1.4) |
| 990 | # | # | $a 10/MJ-16 |
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