| Judul | Methods Unite for Wireless Power Transfer HEMS Module Routes 920MHz Band / TETSUO HIRAYAMA |
| Pengarang | HIRAYAMA, Tetsuo |
| EDISI | Edisi Vol. 18, Serial No. 196 January 2013 |
| Penerbitan | Dempa Asia Electronics Industry, 2013 |
| Deskripsi Fisik | 62 halaman :Tabel, Gambar ;21x28 cm |
| Catatan | Tech Focus : Resistors Brace up for High Power More Deices Emerge for USB 3.0 Industry Report : Parts, Modules Bet on Smartphones |
| Tag | Ind1 | Ind2 | Isi |
| 001 | INLIS000000000006352 | ||
| 005 | 20220610105659 | ||
| 035 | # | # | $a 0010-0622000213 |
| 082 | # | # | $a 050.37 |
| 084 | # | # | $a 050.37 HIR m |
| 100 | 1 | # | $a HIRAYAMA, Tetsuo |
| 245 | 1 | # | $a Methods Unite for Wireless Power Transfer HEMS Module Routes 920MHz Band /$c TETSUO HIRAYAMA |
| 250 | # | # | $a Edisi Vol. 18, Serial No. 196 January 2013 |
| 260 | # | # | :$b Dempa Asia Electronics Industry,$c 2013 |
| 300 | # | # | $a 62 halaman : $b Tabel, Gambar ; $c 21x28 cm |
| 500 | # | # | $a Tech Focus : Resistors Brace up for High Power More Deices Emerge for USB 3.0 Industry Report : Parts, Modules Bet on Smartphones |
| 990 | # | # | $a 21/MJ-16 |
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