| Judul | IPC Defines Interconnect Trends / TETSUO HIRAYAMA |
| Pengarang | HIRAYAMA, Tetsuo |
| EDISI | Edisi Vol. 19, Serial No. 217 October 2014 |
| Penerbitan | Dempa Asia Electronics Industry, 2014 |
| Deskripsi Fisik | 81 halaman :Tabel, Gambar ;21x28 cm |
| Catatan | TPCA Show Special : PWBs Adopt Build-up Multilayer Technique Energy-Related PCBs Employ Thick Cu Boards |
| Tag | Ind1 | Ind2 | Isi |
| 001 | INLIS000000000006357 | ||
| 005 | 20220610111042 | ||
| 035 | # | # | $a 0010-0622000218 |
| 082 | # | # | $a 050.37 |
| 084 | # | # | $a 050.37 HIR i |
| 100 | 1 | # | $a HIRAYAMA, Tetsuo |
| 245 | 1 | # | $a IPC Defines Interconnect Trends /$c TETSUO HIRAYAMA |
| 250 | # | # | $a Edisi Vol. 19, Serial No. 217 October 2014 |
| 260 | # | # | :$b Dempa Asia Electronics Industry,$c 2014 |
| 300 | # | # | $a 81 halaman : $b Tabel, Gambar ; $c 21x28 cm |
| 500 | # | # | $a TPCA Show Special : PWBs Adopt Build-up Multilayer Technique Energy-Related PCBs Employ Thick Cu Boards |
| 990 | # | # | $a 09/MJ-16 |
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