Detail Katalog

ID: 6692

Cover Tidak Tersedia

Gambar cover belum diupload

Industry 4.0 Shores up Smart Factory / TETSUO HIRAYAMA

Edisi: Edisi Vol. 20 , Serial No. 222 March 2015

Pengarang:
HIRAYAMA, Tetsuo

Penerbit:
Dempa Asia Electronics Industry,

Tahun Terbit:
2015

Deskripsi Fisik:
64 Halaman : Tabel, Gambar ; 21x28 cm

Nomor Panggil:
050.37 HIR i

Control Number:
INLIS000000000006396

BIB ID:
0010-0622000257

Catatan

Semicom China 2015 : New Values Define Chip Packaging Solution
Flip-Chip Bonding Fits to Smaller Modules
Special Report :
Disruptive Innovation Creates New Materials

Status

Tersedia di OPAC Bibliografi Nasional Indonesia Karya Tulis Ilmiah Nasional

Informasi Eksemplar & Metadata

Nomor Barcode	Nomor Panggil	Akses	Lokasi	Ketersediaan
`112/MJ-16`	`050.37 HIR i`	Dapat dipinjam	Ruang Sirkulasi	Tersedia

Format MARC21 - Total 12 field

Tag	Ind1	Ind2	Nilai	Urutan
001	`_`	`_`	INLIS000000000006396	1
005	`_`	`_`	20220610024354	2
035	`#`	`#`	$a 0010-0622000257	3
245	`1`	`#`	$a Industry 4.0 Shores up Smart Factory /$c TETSUO HIRAYAMA	4
100	`1`	`#`	$a HIRAYAMA, Tetsuo	5
250	`#`	`#`	$a Edisi Vol. 20 , Serial No. 222 March 2015	6
300	`#`	`#`	$a 64 Halaman : $b Tabel, Gambar ; $c 21x28 cm	7
260	`#`	`#`	:$b Dempa Asia Electronics Industry,$c 2015	8
082	`#`	`#`	$a 050.37	9
084	`#`	`#`	$a 050.37 HIR i	10
500	`#`	`#`	$a Semicom China 2015 : New Values Define Chip Packaging Solution Flip-Chip Bonding Fits to Smaller Modules Special Report : Disruptive Innovation Creates New Materials	11
990	`#`	`#`	$a 112/MJ-16	12

Penjelasan Field MARC21:

001: Control Number
005: Date and Time of Latest Transaction
020: ISBN
100: Main Entry - Personal Name
245: Title Statement

250: Edition Statement
260: Publication Information
300: Physical Description
650: Subject
700: Added Entry - Personal Name

Aksi Cepat

Cari Lagi Browse Katalog

Informasi Katalog

Ditambahkan: 10 Jun 2022

Pencarian Terkait

Karya HIRAYAMA Dari Dempa Asia Electronics Industry, Tahun 2015