=LDR  00000nam  2200000   4500
=001  INLIS000000000006396
=005  20220610024354
=035  ##$$a 0010-0622000257
=245  1#$$a Industry 4.0 Shores up Smart Factory /$c TETSUO HIRAYAMA
=100  1#$$a HIRAYAMA, Tetsuo
=250  ##$$a Edisi Vol. 20 , Serial No. 222 March 2015
=300  ##$$a 64 Halaman : $b Tabel, Gambar ; $c 21x28 cm
=260  ##$:$b Dempa Asia Electronics Industry,$c 2015
=082  ##$$a 050.37
=084  ##$$a 050.37 HIR i
=500  ##$$a Semicom China 2015 : New Values Define Chip Packaging Solution
Flip-Chip Bonding Fits to Smaller Modules 
Special Report :
Disruptive Innovation Creates New Materials
=990  ##$$a 112/MJ-16