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ID: 6653

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IPC Defines Interconnect Trends / TETSUO HIRAYAMA

Edisi: Edisi Vol. 19, Serial No. 217 October 2014

Pengarang

HIRAYAMA, Tetsuo

Penerbit

Dempa Asia Electronics Industry,

Tahun Terbit

2014

Detail Teknis

Deskripsi Fisik

81 halaman : Tabel, Gambar ; 21x28 cm

Nomor Panggil

050.37 HIR i

Control Number

INLIS000000000006357

BIB ID

0010-0622000218

Catatan

TPCA Show Special : PWBs Adopt Build-up Multilayer Technique
Energy-Related PCBs Employ Thick Cu Boards

Status

Tersedia di OPAC Bibliografi Nasional Indonesia Karya Tulis Ilmiah Nasional

Menampilkan 1 edisi serial, 1 eksemplar.

# Edisi Serial Tanggal Terbit Edisi Serial Eksemplar

1 - - 1

#	Nomor Barcode	Call Number	Akses	Lokasi	Ketersediaan
1	`09/MJ-16`	`050.37 HIR i`	Dapat dipinjam	Ruang Sirkulasi	Tersedia

Format MARC21 - Total 12 field

Tag	Ind1	Ind2	Nilai	Urutan
001	`_`	`_`	INLIS000000000006357	1
005	`_`	`_`	20220610111042	2
035	`#`	`#`	$a 0010-0622000218	3
245	`1`	`#`	$a IPC Defines Interconnect Trends /$c TETSUO HIRAYAMA	4
100	`1`	`#`	$a HIRAYAMA, Tetsuo	5
250	`#`	`#`	$a Edisi Vol. 19, Serial No. 217 October 2014	6
300	`#`	`#`	$a 81 halaman : $b Tabel, Gambar ; $c 21x28 cm	7
260	`#`	`#`	:$b Dempa Asia Electronics Industry,$c 2014	8
082	`#`	`#`	$a 050.37	9
084	`#`	`#`	$a 050.37 HIR i	10
500	`#`	`#`	$a TPCA Show Special : PWBs Adopt Build-up Multilayer Technique Energy-Related PCBs Employ Thick Cu Boards	11
990	`#`	`#`	$a 09/MJ-16	12

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10 Jun 2022

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