=LDR  00000nam  2200000   4500
=001  INLIS000000000006357
=005  20220610111042
=035  ##$$a 0010-0622000218
=245  1#$$a IPC Defines Interconnect Trends /$c TETSUO HIRAYAMA
=100  1#$$a HIRAYAMA, Tetsuo
=250  ##$$a Edisi Vol. 19, Serial No. 217 October 2014
=300  ##$$a 81 halaman : $b Tabel, Gambar ; $c 21x28 cm
=260  ##$:$b Dempa Asia Electronics Industry,$c 2014
=082  ##$$a 050.37
=084  ##$$a 050.37 HIR i
=500  ##$$a TPCA Show Special : PWBs Adopt Build-up Multilayer Technique
Energy-Related PCBs Employ Thick Cu Boards
=990  ##$$a 09/MJ-16