<?xml version="1.0" encoding="UTF-8"?>
<collection xmlns="http://www.loc.gov/MARC21/slim">
  <record>
    <leader>00000nam  2200000   4500</leader>
    <controlfield tag="001">INLIS000000000006353</controlfield>
    <controlfield tag="005">20220610110222</controlfield>
    <datafield tag="035" ind1="#" ind2="#">
      <subfield code="a">0010-0622000214</subfield>
    </datafield>
    <datafield tag="245" ind1="1" ind2="#">
      <subfield code="a">Eco Concepts Drive T&amp;M Market /</subfield>
      <subfield code="c">TETSUO HIRAYAMA</subfield>
    </datafield>
    <datafield tag="100" ind1="1" ind2="#">
      <subfield code="a">HIRAYAMA, Tetsuo</subfield>
    </datafield>
    <datafield tag="250" ind1="#" ind2="#">
      <subfield code="a">Edisi Vol. 18, Serial No. 198 March 2013</subfield>
    </datafield>
    <datafield tag="300" ind1="#" ind2="#">
      <subfield code="a">56 halaman :</subfield>
      <subfield code="b">Tabel, Gambar ;</subfield>
      <subfield code="c">21x28 cm</subfield>
    </datafield>
    <datafield tag="260" ind1="#" ind2="#">
      <subfield code="b">Dempa Asia Electronics Industry,</subfield>
      <subfield code="c">2013</subfield>
    </datafield>
    <datafield tag="082" ind1="#" ind2="#">
      <subfield code="a">050.37</subfield>
    </datafield>
    <datafield tag="084" ind1="#" ind2="#">
      <subfield code="a">050.37 HIR e</subfield>
    </datafield>
    <datafield tag="500" ind1="#" ind2="#">
      <subfield code="a">Special Report : electronica, productronica China Material Boost Footing in IC Supply Chain&#13;
Tech Trend : More Parts Cram in Smaller Modules</subfield>
    </datafield>
    <datafield tag="990" ind1="#" ind2="#">
      <subfield code="a">25/MJ-16</subfield>
    </datafield>
  </record>
</collection>
