Detail Katalog

ID: 6685

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SMIC Puts Forth Next Solder Solutions / TETSUO HIRAYAMA

Edisi: Edisi Vol. 20, Serial No. 229 Oktober 2015

Pengarang:
HIRAYAMA, Tetsuo

Penerbit:
Dempa Asia Electronics Industry,

Tahun Terbit:
2015

Deskripsi Fisik:
69 halaman : Tabel, Gambar ; 21x28 cm

Nomor Panggil:
050.37 HIR s

Control Number:
INLIS000000000006389

BIB ID:
0010-0622000250

Special Report : PCB Designs Soar in Great Measure
Methods for Device Embedding Hit Stride

Tersedia di OPAC Bibliografi Nasional Indonesia Karya Tulis Ilmiah Nasional

Nomor Barcode	Nomor Panggil	Akses	Lokasi	Ketersediaan
`07/MJ-16`	`050.37 HIR s`	Dapat dipinjam	Ruang Sirkulasi	Tersedia

Format MARC21 - Total 12 field

Tag	Ind1	Ind2	Nilai	Urutan
001	`_`	`_`	INLIS000000000006389	1
005	`_`	`_`	20220610022605	2
035	`#`	`#`	$a 0010-0622000250	3
245	`1`	`#`	$a SMIC Puts Forth Next Solder Solutions /$c TETSUO HIRAYAMA	4
100	`1`	`#`	$a HIRAYAMA, Tetsuo	5
250	`#`	`#`	$a Edisi Vol. 20, Serial No. 229 Oktober 2015	6
300	`#`	`#`	$a 69 halaman : $b Tabel, Gambar ; $c 21x28 cm	7
260	`#`	`#`	:$b Dempa Asia Electronics Industry,$c 2015	8
082	`#`	`#`	$a 050.37	9
084	`#`	`#`	$a 050.37 HIR s	10
500	`#`	`#`	$a Special Report : PCB Designs Soar in Great Measure Methods for Device Embedding Hit Stride	11
990	`#`	`#`	$a 07/MJ-16	12

Ditambahkan: 10 Jun 2022