Detail Katalog

ID: 6646

Gambar cover belum diupload

3D V-Nand Solves Chip Design Limits Anodes Comply with Global Standard / TETSUO HIRAYAMA

Edisi: Edisi Vol. 18, Serial No. 207 Desember 2013

Pengarang

HIRAYAMA, Tetsuo

Penerbit

Dempa Asia Electronics Industry,

Tahun Terbit

2013

Detail Teknis

Deskripsi Fisik

54 halaman : Tabel, Gambar ; 21x28 cm

Nomor Panggil

050.37 HIR t

Control Number

INLIS000000000006350

BIB ID

0010-0622000211

Catatan

Technology Focus : Board Bending Gets Boost Timing Device Shapes up, Special Report : Components Hinge on New Phone Features

Status

Tersedia di OPAC Bibliografi Nasional Indonesia Karya Tulis Ilmiah Nasional

Menampilkan 1 edisi serial, 1 eksemplar.

# Edisi Serial Tanggal Terbit Edisi Serial Eksemplar

1 - - 1

#	Nomor Barcode	Call Number	Akses	Lokasi	Ketersediaan
1	`04/MJ-16`	`050.37 HIR t`	Dapat dipinjam	Ruang Sirkulasi	Tersedia

Format MARC21 - Total 14 field

Tag	Ind1	Ind2	Nilai	Urutan
001	`_`	`_`	INLIS000000000006350	1
005	`_`	`_`	20220610105133	2
035	`#`	`#`	$a 0010-0622000211	3
005	`_`	`_`	20220610104913	4
245	`1`	`#`	$a 3D V-Nand Solves Chip Design Limits Anodes Comply with Global Standard /$c TETSUO HIRAYAMA	5
100	`1`	`#`	$a HIRAYAMA, Tetsuo	6
250	`#`	`#`	$a Edisi Vol. 18, Serial No. 207 Desember 2013	7
300	`#`	`#`	$a 54 halaman : $b Tabel, Gambar ; $c 21x28 cm	8
260	`#`	`#`	:$b Dempa Asia Electronics Industry,$c 2013	9
082	`#`	`#`	$a 050.37	10
084	`#`	`#`	$a 050.37 HIR t	11
500	`#`	`#`	$a Technology Focus : Board Bending Gets Boost Timing Device Shapes up, Special Report : Components Hinge on New Phone Features	12
008	`_`	`_`	220610################\|##########\|#\|##	13
990	`#`	`#`	$a 04/MJ-16	14

Aksi Cepat

Informasi Katalog

Ditambahkan:
10 Jun 2022

Pencarian Terkait

Export