Detail Katalog

ID: 6646

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3D V-Nand Solves Chip Design Limits Anodes Comply with Global Standard / TETSUO HIRAYAMA

Edisi: Edisi Vol. 18, Serial No. 207 Desember 2013

Pengarang:
HIRAYAMA, Tetsuo

Penerbit:
Dempa Asia Electronics Industry,

Tahun Terbit:
2013

Deskripsi Fisik:
54 halaman : Tabel, Gambar ; 21x28 cm

Nomor Panggil:
050.37 HIR t

Control Number:
INLIS000000000006350

BIB ID:
0010-0622000211

Technology Focus : Board Bending Gets Boost Timing Device Shapes up, Special Report : Components Hinge on New Phone Features

Tersedia di OPAC Bibliografi Nasional Indonesia Karya Tulis Ilmiah Nasional

Nomor Barcode	Nomor Panggil	Akses	Lokasi	Ketersediaan
`04/MJ-16`	`050.37 HIR t`	Dapat dipinjam	Ruang Sirkulasi	Tersedia

Format MARC21 - Total 14 field

Tag	Ind1	Ind2	Nilai	Urutan
001	`_`	`_`	INLIS000000000006350	1
005	`_`	`_`	20220610105133	2
035	`#`	`#`	$a 0010-0622000211	3
005	`_`	`_`	20220610104913	4
245	`1`	`#`	$a 3D V-Nand Solves Chip Design Limits Anodes Comply with Global Standard /$c TETSUO HIRAYAMA	5
100	`1`	`#`	$a HIRAYAMA, Tetsuo	6
250	`#`	`#`	$a Edisi Vol. 18, Serial No. 207 Desember 2013	7
300	`#`	`#`	$a 54 halaman : $b Tabel, Gambar ; $c 21x28 cm	8
260	`#`	`#`	:$b Dempa Asia Electronics Industry,$c 2013	9
082	`#`	`#`	$a 050.37	10
084	`#`	`#`	$a 050.37 HIR t	11
500	`#`	`#`	$a Technology Focus : Board Bending Gets Boost Timing Device Shapes up, Special Report : Components Hinge on New Phone Features	12
008	`_`	`_`	220610################\|##########\|#\|##	13
990	`#`	`#`	$a 04/MJ-16	14

Ditambahkan: 10 Jun 2022