00560     2200169   4500001002100000005001500021035002000036245005700056100002100113250004500134300004400179260004300223082001100266084001700277500008300294990001300377INLIS00000000000637620220610011818  a0010-06220002371 aComponents Tap Future White Goods /cTETSUO HIRAYAMA1 aHIRAYAMA, Tetsuo  aEdisi Vol. 19, Serial No. 210 March 2014  a49 halaman :bTabel, Gambar ;c21x28 cm  bDempa Asia Electronics Industry,c2014  a050.37  a050.37 HIR c  aSpecial Report : Mountable Devices Shrink, 3D Poises as Mainstream Chip Design  a22/MJ-16