00586     2200169   4500001002100000005001500021035002000036245005500056100002100111250004700132300004400179260004300223082001100266084001700277500010900294990001300403INLIS00000000000635720220610111042  a0010-06220002181 aIPC Defines Interconnect Trends /cTETSUO HIRAYAMA1 aHIRAYAMA, Tetsuo  aEdisi Vol. 19, Serial No. 217 October 2014  a81 halaman :bTabel, Gambar ;c21x28 cm  bDempa Asia Electronics Industry,c2014  a050.37  a050.37 HIR i  aTPCA Show Special : PWBs Adopt Build-up Multilayer Technique
Energy-Related PCBs Employ Thick Cu Boards  a09/MJ-16