00724     2200193   4500001002100000005001500021035002000036005001500056245009400071100002100165250004800186300004400234260004300278082001100321084001700332500012900349008003900478990001300517INLIS00000000000635020220610105133  a0010-0622000211202206101049131 a3D V-Nand Solves Chip Design Limits Anodes Comply with Global Standard /cTETSUO HIRAYAMA1 aHIRAYAMA, Tetsuo  aEdisi Vol. 18, Serial No. 207 Desember 2013  a54 halaman :bTabel, Gambar ;c21x28 cm  bDempa Asia Electronics Industry,c2013  a050.37  a050.37 HIR t  aTechnology Focus : Board Bending Gets Boost Timing Device Shapes up, Special Report : Components Hinge on New Phone Features220610                |          | |    a04/MJ-16